Single Crystal Quartz Wafers

Single Crystal Quartz Wafers are thin slices of high-purity silicon dioxide (SiO₂) possessing a defined crystal lattice. Unlike fused silica (amorphous), single crystal quartz exhibits birefringence and high Q-factors, making it indispensable for precision optics, frequency control, and semiconductor substrates.

Key Properties

Piezoelectricity

Generates an electric charge under mechanical stress. This property is the foundation of quartz oscillators and sensors.

High Purity & Stability

Hydrothermally grown to minimize defects, ensuring low thermal expansion and chemical resistance to acids and alkalis.

Anisotropy

Mechanical and optical properties vary based on the crystal axis, requiring precise cutting angles (AT, BT, Z-cuts) for specific functions.

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Common Applications

Frequency Control: Oscillators, resonators, and timing chips.
SAW Devices: Surface Acoustic Wave filters used in mobile communications.
Optics: Waveplates and optical rotators utilizing quartz's birefringence.

Crystal Orientations & Cuts

The angle at which the wafer is sliced from the ingot determines its temperature coefficient and frequency stability.

AT-Cut (35.25° to Z-axis): The industry standard for temperature-stable oscillators.
ST-Cut (42.75° to Y-axis): Primarily used for SAW (Surface Acoustic Wave) applications due to zero temperature coefficient of delay.
Z-Cut (Perpendicular to Z-axis): Standard for optical applications and piezoelectric sensors.

In-Stock Inventory

We stock both Seeded (seed crystal inside the wafer) and Seedless (pure X/Y/Z zone) wafers.

Diameter	Orientation	Thickness	Polish	Grade/App	Type
76.2mm	ST, AT, Z	0.15mm	DSP	SAW	With Seed
76.2mm	42.75° ST	0.35mm	SSP	SAW	With Seed
76.2mm	X, Y, Z	0.35mm	SSP	SAW	With Seed
76.2mm	42.75° ST	0.50mm	SSP	SAW	With Seed
100mm	ST, AT, Z	0.20mm	DSP	SAW	With Seed
100mm	ST-Cut	0.35mm	SSP	SAW	With Seed
100mm	X, Y, Z	0.35mm	SSP	SAW	With Seed
25.4mm	AT, Z-Cut	0.05mm	DSP	SAW	Seedless
50.8mm	AT, Z-Cut	0.10mm	DSP	SAW	With Seed
150mm	Z-Cut	0.675mm	SSP	SAW	Seedless

Technical Note on Surface Finish

SSP (Single Side Polish): Typically used when only one active surface is required (e.g., SAW devices). Roughness < 6Å on the polished side.

DSP (Double Side Polish): Required for transmission optics and high-precision frequency control.